PTFE (Teflon) Tape
Polytetrafluoroethylene (PTFE/Teflon) tape — non-stick, high-temp (260°C), wear and chemical resistant. No residue on removal. Suited for heat sealer protection, spray masking and demolding/release applications.
Key Features
- 260°C rated, no deformation at high temp
- Non-stick, easy demolding, good protection
- Wear and chemical resistant
- No residue on removal
Applications
Heat sealer protection · Spray masking · Demolding/release · Food packaging equipment · Chemical equipment protection
Material Tags
Technical Parameters
| Substrate | PTFE film |
|---|---|
| Temperature | 260 °C |
| Thickness | 0.08–0.20 mm |
| Residue | None |
| Feature | Non-stick wear / Chemical resist |
| Application | Heat seal / Spray / Release protection |
| Die-Cutting Tolerance | ±0.10 mm |
Frequently Asked Questions about PTFE (Teflon) Tape
Common questions about die-cutting and material selection for this product
What Temperature Can PI Polyimide Tape Withstand?
PI (polyimide) tape withstands 260°C long-term and 300°C short-term. Using silicone adhesive, it leaves no residue and doesn't lift at high temperatures — the preferred material for SMT reflow soldering and wave soldering masking. Common thickness 0.05-0.08mm, available in amber and black (black variant also usable for optical light blocking).
What are the special requirements for gold finger tape die-cutting?
Gold finger tape protects the gold finger area during PCB soldering. Requirements: high dimensional accuracy (±0.05 mm) to cover exactly without overflow; no residue after removal that affects conductivity; chemical resistance to withstand plating and cleaning. Common materials: PI polyimide tape or PET red high-temp tape.
What if high-temp masking tape leaves residue after removal?
Residue is usually from adhesive mismatched to temperature. Solutions: confirm temperature stays within rated range (acrylic adhesive residues above 150°C); switch to silicone adhesive (e.g., PI tape, no residue at 260°C); limit heating time; remove while hot — cooling makes residue more likely.
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