High-Temp Masking
Gold Finger Tape
Polyimide (PI) composite high-temp tape — crisp, no curl, rated 200–260°C. No residue on removal, precise masking. Dedicated for PCB gold finger electroplating protection, spray masking and high-temp process protection.
Key Features
- Rated 200–260°C for high-temp processes
- Crisp, no curl, precise masking
- Easy tear, convenient operation
- High masking precision, reliable protection
Applications
PCB gold finger protection · Electroplating masking · Spray masking · High-temp process protection
Material Tags
Specifications
| Substrate | Polyimide (PI) composite |
|---|---|
| Temperature | 200–260 °C |
| Thickness | 0.06–0.15 mm |
| Residue | None |
| Feature | No curl / Easy tear |
| Application | PCB gold finger / Electroplating / Spray |
| Die-Cutting Tolerance | ±0.10 mm |