High-Temp Masking
PI Polyimide Tape
Amber polyimide (PI) high-temp tape, rated 200–260°C, standard for SMT reflow soldering. No residue on removal, with insulation and dimensional stability, no shrinkage. Suited for SMT reflow masking, coil wrapping and high-temp process protection.
Key Features
- Rated 200–260°C, meets reflow requirements
- No residue on removal, no substrate contamination
- Excellent insulation performance
- Dimensionally stable, no shrinkage
Applications
SMT reflow masking · Coil wrapping · High-temp process protection · PCB soldering masking
Material Tags
Specifications
| Substrate | Polyimide film (PI) |
|---|---|
| Temperature | 180–260 °C |
| Thickness | 0.05–0.10 mm |
| Residue | None |
| Feature | Insulation / Dimensional stable |
| Application | SMT reflow / Coil / High-temp |
| Die-Cutting Tolerance | ±0.10 mm |