Thermal Gel
Dispensable thermal interface material (thermal gel) — paste form for automated dispensing, zero-stress filling of irregular gaps. Thermal conductivity 2–8 W/m·K, reworkable. Ideal for BGA packages, irregular gaps and high-power device precision thermal filling.
Key Features
- Zero-stress filling, no damage to fragile components
- High thermal 2–8 W/m·K
- Automated dispensing, high production efficiency
- Reworkable, easy maintenance
Applications
BGA cooling · Irregular gap filling · High-power device cooling · Automated line dispensing
Material Tags
Technical Parameters
| Type | Thermal gel (TIM) |
|---|---|
| Thermal Conductivity | 2–8 W/m·K |
| Form | Paste, dispensable (automated) |
| Volatiles | Low (≤1%) |
| Temperature | −40 ~ 200 °C |
| Feature | Reworkable |
Frequently Asked Questions about Thermal Gel
Common questions about die-cutting and material selection for this product
How to Select Thermal Silicone Pads for Die-Cutting?
Selection based on two key parameters: thermal conductivity matched to chip power (1.5-12 W/mK, higher for higher power), and thickness matched to chip-to-heatsink gap (0.5-5mm). Also consider dielectric strength, hardness, and operating temperature range. Provide chip model and power data for material recommendations.
What's the difference between thermal gel and thermal silicone pad?
Thermal gel is a paste for irregular surfaces and automated dispensing, with no need for precise gap control. Thermal silicone pad is a solid sheet for standardized die-cutting, with precise and controllable thickness and easy installation. Gel suits automated mass production; pad suits manual or semi-auto assembly. Each has its own application.
What die-cutting tolerance can thermal materials achieve?
Thermal silicone pad die-cut dimensions: ±0.10 mm; thickness: ±0.05 mm. Phase-change materials and thermal gels have looser tolerances (±0.20 mm) due to material properties. For high-precision chip cooling, laser die-cutting can achieve ±0.05 mm.
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