Thermal Interface Materials
Thermal Gel
Dispensable thermal interface material (thermal gel) — paste form for automated dispensing, zero-stress filling of irregular gaps. Thermal conductivity 2–8 W/m·K, reworkable. Ideal for BGA packages, irregular gaps and high-power device precision thermal filling.
Key Features
- Zero-stress filling, no damage to fragile components
- High thermal 2–8 W/m·K
- Automated dispensing, high production efficiency
- Reworkable, easy maintenance
Applications
BGA cooling · Irregular gap filling · High-power device cooling · Automated line dispensing
Material Tags
Specifications
| Type | Thermal gel (TIM) |
|---|---|
| Thermal Conductivity | 2–8 W/m·K |
| Form | Paste, dispensable (automated) |
| Volatiles | Low (≤1%) |
| Temperature | −40 ~ 200 °C |
| Feature | Reworkable |