Thermal Silicone Pad
Silicone-based thermal interface material (thermal silicone pad) — soft conformability, low oil bleed, low interfacial thermal resistance. Thermal conductivity 2–12 W/m·K, custom die-cuttable. Efficiently dissipates heat from chips and modules. Widely used in chip cooling, power supplies and LED lighting.
Key Features
- Thermal conductivity 2–12 W/m·K, high cooling efficiency
- Soft low interfacial resistance, tight conformability
- Low oil bleed, no component contamination
- Custom die-cuttable for various shapes
Applications
Chip/module cooling · Power supply cooling · LED lighting cooling · EV electronic control · Telecom equipment cooling
Material Tags
Technical Parameters
| Type | Thermal silicone pad (TIM) |
|---|---|
| Thermal Conductivity | 2–12 W/m·K |
| Thickness | 0.5–5.0 mm |
| Hardness (Shore) | 20–70 (Shore OO) |
| Breakdown Voltage | ≥ 5 kV |
| Temperature | −40 ~ 200 °C |
| Die-Cutting Tolerance | ±0.15 mm |
Frequently Asked Questions about Thermal Silicone Pad
Common questions about die-cutting and material selection for this product
How to Select Thermal Silicone Pads for Die-Cutting?
Selection based on two key parameters: thermal conductivity matched to chip power (1.5-12 W/mK, higher for higher power), and thickness matched to chip-to-heatsink gap (0.5-5mm). Also consider dielectric strength, hardness, and operating temperature range. Provide chip model and power data for material recommendations.
What's the difference between thermal gel and thermal silicone pad?
Thermal gel is a paste for irregular surfaces and automated dispensing, with no need for precise gap control. Thermal silicone pad is a solid sheet for standardized die-cutting, with precise and controllable thickness and easy installation. Gel suits automated mass production; pad suits manual or semi-auto assembly. Each has its own application.
What die-cutting tolerance can thermal materials achieve?
Thermal silicone pad die-cut dimensions: ±0.10 mm; thickness: ±0.05 mm. Phase-change materials and thermal gels have looser tolerances (±0.20 mm) due to material properties. For high-precision chip cooling, laser die-cutting can achieve ±0.05 mm.
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