Conductive Fabric
Fabric-based conductive shielding — flexible, bendable, sewable/wrappable, reliable grounding. 60–80 dB effectiveness. Suited for seams/gaps, moving parts and cable wrapping requiring flexible shielding.
Key Features
- Flexible bendable, fits complex shapes
- Sewable/wrappable, good sealing
- Reliable conductive grounding
- 60–80 dB effectiveness
Applications
Seam/gap shielding · Moving part shielding · Cable wrapping shielding · Equipment seam EMI protection
Material Tags
Technical Parameters
| Substrate | Conductive fabric (silver/nickel plated) |
|---|---|
| Shielding | 60–80 dB |
| Thickness | 0.05–0.15 mm |
| Feature | Flexible sewable |
| Temperature | −40 ~ 120 °C |
| Adhesive Side | Single/double optional |
| Die-Cutting Tolerance | ±0.10 mm |
Frequently Asked Questions about Conductive Fabric
Common questions about die-cutting and material selection for this product
What Shielding Effectiveness Can Copper Foil Die-Cutting Achieve?
Conductive copper foil die-cut parts achieve 60-100 dB shielding effectiveness, covering most EMC scenarios. Actual effectiveness depends on foil thickness (typically 0.018-0.07mm), conductive adhesive type, and overlap area. For high-frequency interference (>1 GHz), use thicker foil and ensure good overlap grounding.
Why are copper foil die-cutting precision requirements so high?
Copper foil shield dimensions directly affect shielding effectiveness — a 0.03 mm error enlarges the lap gap and sharply reduces effectiveness. Copper foil die-cutting tolerance is typically within ±0.05 mm. For precision shielding, use etching dies or laser cutting, plus 100% dimensional inspection.
Which is better — conductive fabric or copper foil shielding?
Conductive fabric is flexible, suits curved and irregular shapes, and bends without breaking. Copper foil has higher effectiveness (10-20 dB more), suits flat shielding and high-frequency scenarios. They are often combined: copper foil for core shielding zones, conductive fabric for gaps and bends. Choose by frequency, shape complexity, and cost.
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