Copper Foil

EMI Shielding · Shielding · Precision Die-Cutting for Electronics

Copper Foil
EMI Shielding

Copper Foil

High-conductivity copper foil shielding — 60–100 dB effectiveness with conductive acrylic adhesive for reliable grounding. Flexible, easy die-cutting. Suited for high-frequency circuits, enclosure gaps and cable EMI shielding.

Key Features

  • 60–100 dB effectiveness, excellent HF shielding
  • Conductive adhesive for reliable grounding
  • Flexible, easy die-cutting, convenient
  • High conductivity, efficient shielding

Applications

High-frequency circuit shielding · Enclosure gap shielding · Cable shielding · Telecom EMI protection

Material Tags

Copper FoilEMI ShieldingHigh ConductivityGroundingConductive Adhesive

Specifications

MaterialHigh-conductivity copper foil
Shielding60–100 dB (10 MHz–1 GHz)
Thickness0.05–0.10 mm
AdhesiveConductive acrylic
Temperature−40 ~ 120 °C
Adhesive SideSingle/double optional
Die-Cutting Tolerance±0.05 mm

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